Rogers pcb board High frequency pcb Rogers tc350 plus DK3.5 ro4350b material ro3003 ro4003c

Rogers’ TC350 PCBs are comprised of PTFE, highly thermally conductive ceramic fillers and woven glass reinforcement. It offers us a unique combination of low insertion loss and higher thermal conductivity. This enables superior reliability and reduced operating temperatures in high power applications.

Rayming PCB & Assembly's TC350 Plus is a glass fiber reinforced and ceramic filled PTFE composite. These materials provide high thermal conductivity and excellent heat dissipation in circuit boards. An advanced filler system also gives the composite improved drilling properties. Improved drilling performance results in reduced manufacturing costs. These laminates are ideal for high power RF signal applications such as power amplifiers and passive components sensitive to temperature phase stability.

The new material offers low tangential and insertion losses, low moisture absorption and excellent dimensional stability. The TC350 Plus material's low loss tangent and high thermal conductivity help increase panel reliability and reduce operating temperatures. Furthermore, they come in various sizes. Therefore, we can use them for different types of applications. They are also preferred for telecommunications and other high-power applications.

Rogers Electronics' RO4835 high-frequency laminate offers increased oxidation resistance and a dielectric constant of 3.48. They exhibit low loss tangent at 10 GHz and are compatible with lead-free processing methods. Their low loss tangent and high electrical stability make them suitable for use in demanding RF/microwave circuits. They also have a similar coefficient of expansion to copper and are RoHS compliant.

Rogers Corporation's TC Series(tm) laminates are designed for RF signal applications and feature high thermal conductivity, low loss tangent and excellent drillability. With their high thermal conductivity and high dielectric strength, they are ideally suited for high-power RF designs, including power amplifiers and passive components that are sensitive to changes in dielectric constant with temperature.

TC350 Plus laminates feature a unique combination of low tangential and insertion losses and highly thermally conductive fillers. The combination of these features improves reliability and reduces operating temperatures in high-power applications. As a result, we can use them in a variety of high-performance applications, including RF antennas, power dividers, couplers, filters, and amplifiers.

TC350 Plus laminates have a variety of applications including amplifiers, combiners, power dividers, couplers, filters and more. They come in a variety of thicknesses, ranging from 0.01 to 0.06 inches. In addition to these applications, TC350 Plus laminate is suitable for the aerospace and defense markets.

Features

· Dielectric constant (Dk) of 3.5

· High thermal conductivity of 0.72 W/m-K

· Low thermal coefficient of Dk at-9 ppm/°C, -40°C to 140°C

· Low loss tangent of .002 at 10GHz

· Low coefficient of thermal expansion on X, Y and Z axis (7, 7, and 23ppm/°C respectively)

Benefits

· Reduced junction temperature and improved reliability

· Excellent heat dissipation and management

· Improved bandwidth utilization and efficiency for amplifiers and antennas

· Unsurpassed plated through hole reliability